Science Behind the Ink
From nanoparticle synthesis to photonic sintering, our technology platform spans the full value chain of conductive ink development and manufacturing.
Nanoparticle Systems
Silver Nanoparticles
Resistivity
2 - 50 µΩ·cm
Particle Size
5 - 100 nm
Highest conductivity ink platform. Our proprietary synthesis achieves near-bulk silver conductivity (1.59 µΩ·cm) with particles as small as 20 nm. Low-temperature sintering compatible with flexible substrates.
- Highest conductivity
- Excellent oxidation resistance
- Wide substrate compatibility
- Multiple curing options
Copper Nanoparticles
Resistivity
4 - 30 µΩ·cm
Particle Size
8.5 nm - 3 µm
Cost-effective conductive platform at 1/100th the material cost of silver. Our oxidation-resistant formulations eliminate the need for inert atmosphere processing through proprietary core-shell and PVP stabilization.
- 100x lower material cost
- No electromigration
- Self-sintering capability
- Abundant raw material
Graphene & Carbon
Resistivity
100 - 3,000 µΩ·cm
Particle Size
Flakes < 5 µm
No sintering required — dry at 80-120°C. Exceptional mechanical flexibility with <5% resistance change after 1,000 bending cycles. Chemically stable, transparent capable, and ideal for sensors and energy storage.
- No sintering needed
- Extreme flexibility
- Chemical stability
- Transparency capable
Printing Methods
Each ink formulation is engineered for specific deposition technologies, from precision inkjet to high-throughput roll-to-roll.
| Method | Type | Viscosity | Resolution | Speed | |
|---|---|---|---|---|---|
| Inkjet Printing | Non-Contact | 2 - 15 cP | High (µm-scale) | Medium | |
| Screen Printing | Contact | 35,000 - 200,000 cP | Medium | High | |
| Flexography | Rotary Contact | 50 - 500 cP | Medium | Very High | |
| Gravure Printing | Rotary Contact | 50 - 200 cP | High | Very High | |
| Aerosol Jet | Non-Contact | 1 - 1,000 cP | Very High | Low | |
| Pad Printing | Transfer | 8,000 - 25,000 cP | Medium-High | Medium |
Sintering & Curing
Multiple curing technologies enable processing on substrates ranging from high-temperature ceramics to temperature-sensitive polymer films.
Thermal Sintering
Temperature
150 - 300°C
Duration
5 - 120 min
Conventional oven or hotplate sintering. Reliable and well-understood process for high-temperature substrates.
Flash Photonic (IPL)
Temperature
Ambient (surface >1000°C)
Duration
Milliseconds
Intense pulsed light enables ultra-fast selective sintering. Processes temperature-sensitive substrates without thermal damage.
Low-Temperature
Temperature
70 - 150°C
Duration
10 - 120 min
Compatible with polymer substrates (PET, PC). Enables printed electronics on consumer-grade flexible films.
Chemical Sintering
Temperature
Ambient
Duration
Minutes
Room-temperature sintering using chemical agents. No external heat source required — suitable for any substrate.
Laser Sintering
Temperature
Localized
Duration
Seconds
Ultra-precise selective sintering with µm accuracy. Enables pattern-wise sintering without masks or stencils.
Two-Stage Cure
Temperature
150°C + 250°C
Duration
30 min + 30 min
Dual-step process for polyimide and high-temperature formulations. First stage drives off solvents; second stage achieves maximum silver sintering and bond strength.
Interested in our technology?
Request a technical consultation or visit our facilities in Montevideo.
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