Conductive Ink Portfolio
Over 50 formulations — silver, copper, graphene, hybrid, carbon resistive, dielectric, and conductive adhesive systems for printed electronics, photovoltaics, medical devices, and advanced IoT applications.
NC-Ag 101
Silver NanoInk
High-conductivity silver nanoparticle ink optimized for precision inkjet deposition. Achieves near-bulk silver conductivity with low-temperature sintering compatibility.
Technical Specifications
NC-Ag 201
Silver NanoPaste
High-viscosity silver nanoparticle paste for screen printing thick conductive traces. Excellent adhesion and conductivity on diverse substrates including flexible films.
Technical Specifications
NC-Ag 210
Silver NanoPaste HT
High-temperature silver paste rated to 350°C continuous service, with short-term excursions to 410°C. Dual-stage cure delivers exceptional thermal and electrical stability. Thermal conductivity >10 W/m·K.
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NC-Ag 220
Silver NanoPaste SR
Standard silver paste with low-temperature cure at 110°C and outstanding chemical resistance to MEK and acetone after cure. Operating range −55°C to +200°C.
Technical Specifications
NC-Ag 230
Silver NanoPaste ITO
Specially formulated silver paste with enhanced adhesion to ITO-sputtered surfaces and low-surface-energy substrates. Compatible with Kynar, Kapton, Mylar, and polycarbonate. Operating range −55°C to +200°C.
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NC-Ag 240
Silver NanoPaste WB
Waterborne, low-VOC silver ink compliant with NMP-free regulations. Suitable for facilities with strict solvent emission controls. Operating range −55°C to +140°C.
Technical Specifications
NC-Ag 250
Silver EpoxyBond 2K
Two-component epoxy silver paste with solvent resistance to MEK, acetone, and isopropanol. Designed for crossover circuits with UV-curable dielectric layers. Pot life up to 2 weeks after mixing. Temperature range −55°C to +200°C, short-term to +280°C.
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NC-Ag 260
Silver SolventResist
Solvent-resistant silver paste designed for shielding polyimide flexible circuits subjected to aggressive chemical environments. Resists MEK and acetone. Operating range −55°C to +200°C, thermal stability to +325°C.
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NC-Ag 501
Silver Stretchable
Stretchable and washable elastomeric silver conductor. Maintains conductivity after 50%+ elongation and multiple wash cycles. Operating range −55°C to +120°C.
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NC-Ag 510
Silver Elastomeric HB
High-bend-cycle elastomeric silver paste delivering consistent sheet resistance after >10,000 flex cycles. Conductivity maintained up to 200% elongation. Operating range −55°C to +120°C.
Technical Specifications
NC-Ag 520
Silver Silicone
Silicone-matrix silver paste with exceptional thermal range −70°C to +260°C and thermal conductivity 12.07 W/m·K. One of the few silver inks that bonds to silicone, Teflon, and rubber surfaces directly.
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NC-Ag 701
Silver PadPrint
Solvent-resistant pad-printing silver paste for precision narrow circuit lines. Excellent adhesion to Kapton, heat-stabilized polyester, and glass. Resists MEK and acetone. Operating range −55°C to +200°C.
Technical Specifications
NC-Ag 710
Silver PadPrint EF
Extremely flexible pad-printing silver paste for elastomeric and difficult substrates. Version of our proven elastomeric screen-print formula adapted for pad-print viscosity. Glass transition temperature 75°C.
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NC-Ag 720
Silver PadPrint PL
Plateable silver pad-print paste enabling subsequent electroless and electrolytic plating operations. Promotes auto-nucleation in electrolytic processes. Used as underlying layer for decorative or functional gold/nickel finishes. Operating range −55°C to +250°C.
Technical Specifications
NC-Ag 301
Silver NanoFlex
Roll-to-roll compatible silver nanoink for high-throughput flexographic and gravure printing. Ideal for large-area electronics and smart packaging applications. Density 2.05 g/cc, solids 66 ± 1.5%.
Technical Specifications
NC-Ag 310
Silver NanoFlex WB
Water-based, low-VOC silver flexographic ink for sustainable smart packaging and disposable sensor applications. Eliminates solvent waste and is compatible with water-based dielectric overprints. Operating range −55°C to +140°C.
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NC-Ag 320
Silver NanoFlex HS
Ultra-low-viscosity rotogravure silver ink for in-line press production at speeds >150 m/min. Optimized for medical electrode and ECG strip manufacturing. Do not use metal tools (AgCl reactivity). Operating range −55°C to +200°C.
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NC-Ag 401
Silver NanoSpray
Fast-drying silver nanoparticle ink for spray and aerosol jet deposition on 3D and curved surfaces. Low viscosity enables atomization for conformal coatings. Ag content 87 wt%. Conductivity reaches maximum in 5–10 min at 150°C.
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NC-Ag/AgCl 101
Silver-AgCl Standard
Standard Ag/AgCl 82:18 electrode ink for ECG, EEG, and TENS electrodes. Provides stable half-cell potential with low DC offset. Volume resistivity 0.0002 Ω·cm. Operating range −55°C to +200°C, thermal stability to +325°C.
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NC-Ag/AgCl 110
Silver-AgCl Medical WB
Waterborne, VOC-free Ag/AgCl electrode ink in 85:15 ratio. Eliminates solvent waste and is compatible with water-based overprints. Low viscosity enables flexographic deposition for high-volume disposable electrode production.
Technical Specifications
Compatibility
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NC-Ag/AgCl 120
Silver-AgCl Reference
High AgCl-content electrode ink in 66:34 ratio for stable quasi-reference electrodes in electrochemical biosensors. Minimizes potential drift during long-duration measurements. Volume resistivity 0.0002 Ω·cm.
Technical Specifications
NC-Cu 101
Copper NanoInk
Oxidation-resistant copper microparticle paste with self-sintering capability. No inert atmosphere required. Cost-effective alternative to silver at 1/100th material cost.
Technical Specifications
NC-Cu 201
Copper Core-Shell
Cu@Ag core-shell nanoparticle paste delivering exceptional conductivity with silver-like oxidation resistance at a fraction of the cost. Sheet resistance of 0.21 Ω/sq.
Technical Specifications
NC-Gr 101
Graphene Conductor
Graphene-based conductive ink requiring no sintering step. Excellent mechanical flexibility with <5% resistance change after 1000 bending cycles. Chemically stable and cost-effective.
Technical Specifications
Compatibility
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NC-Gr 201
CNT Conductor
Double-walled carbon nanotube ink for transparent conductive films. Achieves 3.6×10⁵ S/m conductivity with <3% resistance change at 1 mm bend radius.
Technical Specifications
NC-Hy 101
Hybrid Ag-Cu
Silver-copper hybrid nanoparticle paste combining silver-grade conductivity with copper economics. Flash photonic sintering enables processing on temperature-sensitive substrates.
Technical Specifications
NC-Hy 201
Hybrid Ag-Graphene
Silver nanoparticle / graphene nanoplatelet composite ink with enhanced strain sensitivity and stability. Sheet resistance as low as 0.08 Ω/sq achievable.
Technical Specifications
NC-C 101
Carbon Resistive Standard
Low-resistance carbon ink delivering 8 Ω/sq/mil — significantly below the industry standard of 20 Ω/sq/mil. Excellent adhesion to polyester and polyimide with outstanding abrasion, flexing, and long-term aging resistance. Used as cost-effective resistive layer in hybrid silver–carbon circuit architectures.
Technical Specifications
NC-C 201
Carbon Resistive HT
High-temperature epoxy carbon ink for resistive applications on polyimide substrates at elevated service temperatures. Two-component system with long pot life. Elastomeric silicone variant available for non-flammable environments.
Technical Specifications
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NC-C 301
Carbon Resistive WB
Water-based, NMP-free carbon ink for flexographic R2R printing of disposable resistive sensors and cost-sensitive applications. Eliminates solvent waste and simplifies occupational-safety compliance. Compatible with water-based dielectric overprints.
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NC-Di 101
Dielectric UV-Cure
Fast-curing UV dielectric ink for crossover circuits and insulating layers in multilayer PTF assemblies. Green matte finish, excellent humidity and solvent resistance, high flexibility after cure. Dielectric breakdown voltage 1,300 V/mil. Compatible as inter-layer dielectric between silver conductor traces.
Technical Specifications
NC-Di 201
Dielectric HDS
High dielectric strength (2,500 V/mil) insulating coating for applications requiring robust voltage isolation. One-component urethane system with exceptional UV and moisture resistance. Dielectric constant 4.1 at 100 Hz. No substrate pre-treatment required on most plastics and polyimides.
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NC-CA 101
Conductive Adhesive 1K
One-part latent-cure silver conductive adhesive for SMD attachment and die bonding. B-stageable at 80°C for tack-free handling before final cure. Low coefficient of thermal expansion (CTE), excellent bond strength to dissimilar substrates. Operating range −55°C to +200°C.
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NC-CA 201
Conductive Adhesive 2K
Two-part room-temperature cure silver epoxy adhesive. Tensile shear strength >1,800 psi. Fast-setting variant available (working life 5 min, handleable in 30 min). Thermal conductivity 12.7 W/m·K. Operating range −70°C to +260°C with short-term stability to 325°C.
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NC-RO 101
Radio-Opaque Medical
Lead-free, biocompatible radio-opaque ink for X-ray, CT, and fluoroscopy visibility marking on medical devices. Flexible formulation withstands repeated flexing and creasing on catheter shafts, balloon markers, and guidewire tips. Available in standard, blue (125-09MDB), and pink (128-08) colorways. Adheres to difficult-to-bond substrates including Pebax, fluoropolymers, and silicone.
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